Exchange the CEC enclosure system processor module

Before you begin

CAUTION:
This assembly contains mechanical moving parts. Use care when you service this assembly. (C025)

Icon for electrostatic discharge wrist strapUse approved ESD procedures to prevent damage.

Attention:
  • This procedure is not a stand-alone procedure. Customer disruption and damage to the hardware might occur when microcode and power boundaries are not in the proper conditions for this service action.
  • If a serviceable event FRU repair directed you to this procedure, the microcode and power boundaries are already set.
  • If a serviceable event FRU repair did not direct you to this procedure, see MAP1230 Replace a FRU without using a serviceable event.
Notes:
  • All the cables and FRUs to be removed must be uniquely identified so they can be reinstalled correctly.
  • If an installed earthquake resistance kit prevents you from accessing this FRU, refer to MAP1600.

Preparing the CEC enclosure to remove and replace the system processor module

Procedure

  1. Use a replacement part with a valid DS8000® part number to ensure it has the proper firmware, VPD, and/or configuration to ensure it is compatible with the DS8000 service procedures. Attempting to use a generic server FRU might fail and require next level of support to recover.
  2. All parts being removed must be marked or identified so they can be installed into their original locations.
    Note: Failure to do this can extend the service duration and may require next level of support assistance.
  3. The management console keyboard can be moved between the operating and stowed position as needed to allow service clearance above the CEC enclosure.
  4. Use the front and rear blue identify LEDs to determine the CEC enclosure to be repaired. Both blue LEDs should be lit.
    • CEC control panel blue identify LED Callout label B as shown in Figure 1.
    • CEC enclosure rear blue identify LED Callout label 1 as shown in Figure 2.
    Note: If both the front and rear CEC enclosure identify LEDs are not lit, use the location code listed in the serviceable event FRU list. See MAP1245 Finding FRUs by using location codes.
    Figure 1. Control panel LEDs
    Control panel LEDs
    Figure 2. CEC enclosure rear LEDs
    Rear view of the CEC enclosure LEDs
  5. Verify that the CEC enclosure is in the power-off state. See Figure 3
    1. At the rear of the CEC enclosure, view all CEC enclosure power supply DC LEDs.
    2. Are all DC (output) LEDs flashing?
    Figure 3. Location of the power supplies and LEDs (Models 981, 985, 986)
    Location of the power supplies and LEDs (Models 981, 985, 986)
  6. Attach the electrostatic discharge (ESD) wrist strap.
    Attention:
    • Attach an electrostatic discharge (ESD) wrist strap to an unpainted metal surface of your hardware to prevent the electrostatic discharge from damaging your hardware.
    • When using an ESD wrist strap, follow all electrical safety procedures. An ESD wrist strap is used for static control. It does not increase or decrease your risk of receiving electric shock when using or working on electrical equipment.
    • If you do not have an ESD wrist strap, just prior to removing the product from ESD packaging and installing or replacing hardware, touch an unpainted metal surface of the system for a minimum of 5 seconds.
  7. Disconnect the power cords Callout label B from the CEC with the DC (output) LEDs flashing. See Figure 4.
    Notes:
    • Ensure the power cords are correctly labeled.
    • The power supply LEDs might continue to flash for up to 20 seconds while internal power is discharged.
    • The power cord is fastened to the system using the hook-and-loop fastener Callout label A. Unstrap the fastener to allow the enclosure to be placed in the service position.
    Figure 4. Removing the power cords (Models 981, 985, 986)
    Removing the power cords (Model 981)
  8. Observe the CEC enclosure control panel green power button LED Callout label A. See Figure 5.
    • If it is off, go to the next step.
    • If it is flashing, the CEC enclosure is still in the power-off state. DO NOT CONTINUE. Ensure that you have unplugged the power cables.
    Figure 5. Control panel LEDs
    Control panel LEDs
  9. Disconnect all remaining cables from the rear of the CEC enclosure. See Table 1 and Figure 6.
    Table 1. CEC enclosure cable connections
    Connection Description
    P1-T3 (HMC 1) FSP Ethernet
    P1-T4 (HMC 2) FSP Ethernet
    P1-C3-T1, P1-C3-T2 PCIe to I/O enclosures (if C3 present)
    P1-C5-T1, P1-C5-T2 PCIe to I/O enclosures (if C5 present)
    P1-C6-T1, P1-C6-T2 PCIe to I/O enclosures
    P1-C7-T1, P1-C7-T2 PCIe to I/O enclosures
    P1-C8-T1, P1-C8-T2 i2c to RPCs
    P1-C10-T1, P1-C10-T2 LPAR Ethernet
    P1-C10-T3, P1-C10-T4 Customer network (optional feature, if used)
    P1-C11-T1, P1-C11-T2
    P1-C11-T3, P1-C11-T4    		 Customer network (optional feature, if used)
    P1-C12-T1, P1-C12-T2 RS485 to RPCs
    Figure 6. CEC enclosure location codes (rear view) (Models 981, 985, and 986)
    CEC enclosure location codes (rear view)
  10. Remove the front cover.
    1. Ensure that you have the electrostatic discharge (ESD) wrist strap attached. If not, attach it now.
    2. Remove the two shipping screws Callout label A (if present) that secure the system to the rack.
    3. Pull the cover away from the system. The cover has an indentation where you can hold onto it more easily.
    Figure 7. Removing the front cover
    Removing the front cover
  11. Place the CEC enclosure into the service position.
    1. Remove the front screws Callout label A (if present) that secure the enclosure to the rack.
      Figure 8. Removing the front screws
      Removing the front screws
    2. Release the side latches Callout label B and pull the latches to slide out the enclosure assembly.
      Figure 9. Releasing the side latches
      Releasing the side latches
  12. Remove the service access cover.
    1. Ensure that you have the electrostatic discharge (ESD) wrist strap attached. If not, attach it now.
    2. Release the latch by pushing the release latch Callout label A in the direction shown.
    3. Slide the cover Callout label B off the system unit. When the front of the service access cover has cleared the upper frame ledge, lift the cover up and off the system unit. Attention: For proper cooling and airflow, replace the cover before turning on the system.
    Figure 10. Removing the service access cover
    Removing the service access cover
  13. Attach the electrostatic discharge (ESD) wrist strap. Your system has an ESD pin on the backplane as shown in Figure L. Attach the ESD wrist strap to the ESD pin.
    Attention:
    • Attach an electrostatic discharge (ESD) wrist strap to an unpainted metal surface of your hardware to prevent the electrostatic discharge from damaging your hardware.
    • When using an ESD wrist strap, follow all electrical safety procedures. An ESD wrist strap is used for static control. It does not increase or decrease your risk of receiving electric shock when using or working on electrical equipment.
    • If you do not have an ESD wrist strap, just prior to removing the product from ESD packaging and installing or replacing hardware, touch an unpainted metal surface of the system for a minimum of 5 seconds.
    Figure 11. Location of the ESD pin
    Location of the ESD pin

Removing the CEC enclosure system processor module

About this task

To remove the CEC enclosure system processor module, complete the following steps:

Procedure

  1. Ensure that you have the electrostatic discharge (ESD) wrist strap attached. If not, attach it now.
  2. Open the hinged air baffle.
    1. Pull the latches Callout label A to disengage the air baffle from the chassis.
    2. Lift the air baffle Callout label B up to open it.
    Figure 12. Opening the air baffle
    Opening the air baffle
  3. Remove the hinged air baffle.
    1. Pull the air baffle to disengage it from the chassis clasp Callout label A.
    2. Lift the air baffle up to remove it.
    Figure 13. Removing the air baffle
    Removing the air baffle
  4. Open the packaging of the new system processor module, and place the cover upside down next to the tray, as shown in Figure 14. The cover is used for the system processor module that you are replacing.
    Figure 14. Opening the system processor module packaging
    Opening the system processor module packaging
  5. Remove the heat sink.
    1. Loosen the heat sink actuation screw by turning the supplied 5.5 mm nut driver (part number 43W3032) counterclockwise Callout label A until the screw becomes loose and moves freely as shown in Figure 15.
    2. Grip the heat sink Callout label B by the grooves on opposing sides and remove it by lifting straight up.
    3. Inspect the heat sink for any dust or debris on it. If you must remove dust or debris from the heat sink, it must be done in another room or greater than 25 feet (7.62 meters) away from work area.
    4. Place the heat sink upside down on an electrostatic discharge (ESD) surface.
    Figure 15. Removing the heat sink
    Removing the heat sink
  6. Remove dust and debris from the system processor module area.
    1. If dust or debris is present, use the supplied air pump (part number 45D2645) to clean the system processor module area. Blow small bursts of air from the center toward the sides of the system processor module as shown in Figure 16.
    Figure 16. Removing dust and debris from the system processor module area
    Removing dust and debris from the system processor module area
  7. Prepare the system processor module for removal.
    1. Using the supplied removal tool (part number 00E8483), align the beveled corner Callout label A of the tool over the beveled corner of the system processor module as shown in Figure 17.
    2. Lower the tool over the system processor module by ensuring the two guide pins Callout label C are inserted into the alignment holes Callout label B on each side of the tool.
      Figure 17. Lowering the removal tool onto the system processor module
      Lowering the removal tool onto the system processor module
    3. With the removal tool Callout label A sitting on top of the system processor module, push down on the tool to lock the system processor module into the tool, as shown in Figure 18. Make sure that both of the tool jaws are locked on the system processor module. Do not press the blue release tabs until directed to do so later.
      Note: The tool drops slightly when you push down so that the jaws can grab the bottom of the system processor module.
      Figure 18. Locking the system processor module into the tool
      Locking the system processor module into the tool
  8. Holding the outside of the tool, lift the tool and system processor module from the socket. Place them at an angle in the top cover of the system processor module packaging (if available), or other appropriate ESD surface, as shown in Figure 19.
    Note: Setting the tool and system processor module at an angle on the top cover of the system processor module packaging will make it easier to pick up and place in the packaging after you replace the system processor module.
    Figure 19. Placing the tool at an angle on the top cover of the packaging
    Placing the tool at an angle on the top cover of the packaging
  9. Squeeze the two blue tabs to release the system processor module from the tool. See Figure 20.
    Note: To prevent the system processor module from falling, do not squeeze the two tabs before you place the tool on the top cover of the system processor module packaging.
    Figure 20. Releasing the system processor module from the tool
    Releasing the system processor module from the tool

Replacing the CEC enclosure system processor module

About this task

To replace the CEC enclosure system processor module, complete the following steps:

Procedure

  1. Ensure that you have the electrostatic discharge (ESD) wrist strap attached. If not, attach it now.
  2. Prepare the system processor module for installation:
    1. Remove the replacement processor module from the shipping tray. Using the supplied removal tool (part number 00E8483), align the beveled corner Callout label A of the tool over the beveled corner of the module, as shown in Figure 21.
    2. Lower the tool over the system processor module by ensuring that the two guide pins Callout label C are inserted into the alignment holes Callout label B on each side of the tool, as shown in Figure 21. Then, push down on the tool to lock the system processor module into the tool, as shown in Figure 22. Do not press the blue release tabs until directed to do so later.
      Figure 21. Preparing for system processor module installation
      Preparing for system processor module installation
      Figure 22. Locking the system processor module into the tool
      Locking the system processor module into the tool
  3. Prepare for system processor module installation:
    1. Grasping the sides of the tool and system processor module, carefully lift it slightly out of the system processor module tray. Then, turn it over so that the system processor module side is up.
    2. Ensure that both jaws Callout label A are firmly grabbing the system processor module, as shown in Figure 23.
      Note: If both jaws are not firmly grabbing the system processor module, press down on the corner of the system processor module closest to the jaw until it locks into place. Do not touch any part of the system processor module other than the corners.
    Figure 23. Preparing for system processor module installation
    Preparing for system processor module installation
  4. Install the system processor module:
    1. Lower the tool and system processor module onto the socket, ensuring that the two guide pins are inserted into the alignment holes on each side of the tool, as shown in Figure 24.
      Note: Do not attempt to slide the tool and the system processor module in any direction while the system processor module is touching the socket. If the tool and the system processor module are not aligned with the guide pins, lift the tool and the system processor module and reposition them.
      Figure 24. Installing the system processor module
      Installing the system processor module
    2. After the tool and system processor module holes and guide pins are properly aligned, squeeze and hold the two blue release tabs Callout label A together until a firm stop is reached, as shown in Figure 25. Then, lift the tool off the system processor module.
      Figure 25. Removing the system processor module tool
      Removing the system processor module tool
  5. Inspect the thermal interface material (TIM) for visible signs of damage, as shown in Figure 26.
    Note: When the heat sink is removed from the failed system processor module, the TIM should be adhered to the heat sink. Unless damaged, the TIM that is adhered to the heat sink can be reused. Replacing the TIM is optional and is only performed if the TIM is damaged. Do not reuse the removed heat sink if the TIM is damaged. Either discard the heat sink and the damaged TIM locally or return them to IBM based on part-order-form part status. It is recommended that a spare TIM and heat sink, part number 00E8868, be on hand when replacing the system processor module.
    Figure 26. Inspecting the thermal interface material
    Inspecting the thermal interface material
  6. Are you replacing the TIM or heat sink?
    • Yes, continue with step 7.
    • No, go to step 8.
  7. Install a new TIM pad:
    1. If the TIM or heat sink must be replaced, order part number 00E8868, heat sink, and TIM.
    2. Open the TIM packaging and carefully remove the TIM, holding it by the edges of the carrier strip and holding it away from the shipping container.
    3. Remove the protective film from the clear carrier strip by using the supplied tweezers.
      Note: The TIM must remain flat. Small wrinkles are acceptable, but folds are not acceptable.
    4. Using the tweezers, remove the TIM from the carrier strip and center it onto the system processor module with the black side facing up. If the replacement TIM has a red stripe, the side with the red stripe must be facing up. Align the beveled edges of the TIM and the system processor module Callout label A, as shown in Figure 27.
    Figure 27. Installing the TIM onto the processor lid
    Installing the TIM onto the processor lid
  8. Install the heat sink:
    1. Lower the heat sink over the system processor module, ensuring that the two guide pins Callout label B are inserted into the alignment holes on each side of the tool, as shown in Figure 28.
    2. Ensure that the heat sink load arm is engaged.
      Note: If the load arm is not engaged, you must manually engage the load arm onto the heat sink while the load screw is being tightened. See Figure 29.
    Figure 28. Installing the heat sink
    Installing the heat sink
  9. Secure the heat sink:
    1. Upon placing the heat sink on the system processor module, ensure that the heat sink load arm on the side of the heat sink becomes engaged, as shown in Figure 29.
    2. While you are holding the heat sink in place, use the supplied 5.5 mm nut driver (part number 43W3032) to tighten the heat sink actuation screw. Turn the screw clockwise a few turns.
    3. Is the load arm still engaged?
      • Yes, continue turning the actuation screw clockwise until a firm stop is reached. If a torque tool is available, tighten the screw to 2.5 nm.
      • No, unscrew the actuation screw. Hold the load arm onto the heat sink while you are tightening the screw until a firm stop is reached. If a torque tool is available, tighten the screw to 2.5 nm.
      Note: If during this step, the heat sink moves noticeably, it is likely that the load arm is not engaged. If the heat sink moves noticeably, unscrew the actuation screw and hold the load arm onto the heat sink while you are tightening the screw until a firm stop is reached. If a torque tool is available, tighten the screw to 2.5 nm.
    Figure 29. Securing the heat sink
    Securing the heat sink
  10. Lightly grip the system processor module that you replaced by the edges and lift it off of the packaging cover. Align the beveled corner of the module Callout label A to the corner of the packaging with triangle Callout label B and place it in the packaging, as shown in Figure 30. Close the packaging cover.
    Figure 30. Placing the system processor module into the packaging
    Placing the system processor module into the packaging
  11. Replace the hinged air baffle.
    1. Push the air baffle toward the chassis.
    2. Fix the air baffle to the chassis by pushing the clasp onto the chassis Callout label A until it locks into place.
    Figure 31. Replacing the air baffle
    Replacing the air baffle
  12. Close the hinged air baffle.
    1. Push down the air baffle Callout label B toward the chassis.
    2. Press the side latches Callout label A to latch the air baffle to the chassis.
    Figure 32. Closing the air baffle
    Closing the air baffle adapter

Preparing the CEC enclosure for operation after removing and replacing the system processor module

About this task

To prepare the system for operation, complete the following steps:

Procedure

  1. Ensure that you have the electrostatic discharge (ESD) wrist strap attached. If not, attach it now.
  2. Replace the service access cover.
    1. Slide the cover Callout label B on to the system unit.
    2. Close the latch release Callout label A by pushing it in the direction shown.
    Figure 33. Installing the service access cover
    Installing the service access cover
  3. Ensure that you have the electrostatic discharge (ESD) wrist strap attached. If not, attach it now.
  4. Place the CEC enclosure into the operating position.
    1. Ensure that you have the electrostatic discharge (ESD) wrist strap attached. If not, attach it now.
    2. Unlock the blue rail safety latches Callout label A by lifting them upward.
    3. Push the system unit Callout label B back into the rack until both system unit release latches lock into position.
    4. Secure the enclosure to the rack with screws, if screws were removed when preparing the enclosure for service.
    Figure 34. Placing the CEC enclosure into the operating position
    Placing the CEC enclosure into the operating position
  5. Replace the front cover.
    1. Push the cover onto the system.
    2. Gently push the cover in until the cover clips Callout label A are seated in their respective mounting posts as shown in Figure 35. The cover snaps into place and has an indentation where you can hold onto it more easily.
    3. Replace the shipping screws Callout label B.
    Figure 35. Installing the front cover
    Installing the front cover
  6. Attach the electrostatic discharge (ESD) wrist strap.
  7. Reconnect all cables, except for power cords. See Table 2 and Figure 36.
    If optical Ethernet connections are used, use proper cleaning procedures.
    Important: The optical cable plugs (LC connectors) and ports (SFPs) must be cleaned before connecting them. Use cleaning tool 54Y4392 or IBM-approved alternative. After cleaning SFPs with the tool, use air bulb 45D2645 or IBM-approved alternative. For detailed procedures, refer to current DS8000 Info Alerts or contact your next level of support.
    Table 2. CEC enclosure cable connections
    Connection Description
    P1-T3 (HMC 1) FSP Ethernet
    P1-T4 (HMC 2) FSP Ethernet
    P1-C3-T1, P1-C3-T2 PCIe to I/O enclosures (if C3 present)
    P1-C5-T1, P1-C5-T2 PCIe to I/O enclosures (if C5 present)
    P1-C6-T1, P1-C6-T2 PCIe to I/O enclosures
    P1-C7-T1, P1-C7-T2 PCIe to I/O enclosures
    P1-C8-T1, P1-C8-T2 i2c to RPCs
    P1-C10-T1, P1-C10-T2 LPAR Ethernet
    P1-C10-T3, P1-C10-T4 Customer network (optional feature, if used)
    P1-C11-T1, P1-C11-T2
    P1-C11-T3, P1-C11-T4    		 Customer network (optional feature, if used)
    P1-C12-T1, P1-C12-T2 RS485 to RPCs
    Figure 36. CEC enclosure location codes (rear view) (Models 981, 985, and 986)
    CEC enclosure location codes (rear view)
  8. Reconnect the power cords Callout label A to the CEC enclosure. See Figure 37.
  9. Fasten the power cords to the enclosure using the hook-and-loop fasteners Callout label B.
    Figure 37. Connecting the power cords
    Connecting the power cords
  10. Verify the CEC enclosure has power available. See Figure 38.
    1. At the rear of the CEC enclosure, view the CEC enclosure power supply DC LEDs.
    2. Are all DC (output) LEDs flashing?
      • Yes, continue with the next step.
      • No, ensure the power cords are properly connected. If no connection problem is found, contact your next level of support.
    Figure 38. Location of the power supplies and LEDs (Models 981, 985, 986)
    Location of the power supplies and LEDs (Models 981, 985, 986)
  11. Wait up to 5 minutes for the CEC enclosure control panel power button LED [A] to flash. See Figure 39.
    Note: This ensures the CEC enclosure is in the power-off state.

    Is the power button LED flashing?

    • Yes, go to the next step.
    • No, ensure the CEC enclosure power supplies are fully seated. The possible failing FRUs are the CEC enclosure system backplane, I2C interface card and cables, and control panel. You can also call the next level of support.
    Figure 39. Control panel LEDs
    Control panel LEDs
  12. Close the rear door of the rack.
  13. Exit this service information center parts exchange procedure and return to the procedure that sent you here.